Dr. Ahmed G. Abo-Khalil

Electrical Engineering Department

Flip chip

Flip chip, also known as controlled collapse chip connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is flowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.

Office Hours

Monday 10 -2

Tuesday 10-12

Thursday 11-1

My Timetable

Contacts


email: [email protected]

[email protected]

Phone: 2570

Welcome

Welcome To Faculty of Engineering

Almajmaah University

IEEE

Institute of Electrical and Electronics Engineers

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Links of Interest

http://www.utk.edu/research/

http://science.doe.gov/grants/index.asp

http://www1.eere.energy.gov/vehiclesandfuels/

http://www.eere.energy.gov/


القران الكريم

http://quran.muslim-web.com/

Travel Web Sites

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http://www.hotwire.com/us/index.jsp

http://www.kayak.com/

Photovoltaic Operation


Wave Power

World's Simplest Electric Train



PeltierModule-JouleThief-Fridge

homemade Aircondition

Salt water battery


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