Dr. Ahmed G. Abo-Khalil

Electrical Engineering Department

Flip chip

Flip chip, also known as controlled collapse chip connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is flowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.

Office Hours

Monday 10 -2

Tuesday 10-12

Thursday 11-1

My Timetable


Contacts


email: [email protected]

[email protected]

Phone: 2570

Welcome

Welcome To Faculty of Engineering

Almajmaah University


IEEE


http://www.ieee.org/

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Links of Interest


http://www.utk.edu/research/

http://science.doe.gov/grants/index.asp

http://www1.eere.energy.gov/vehiclesandfuels/

http://www.eere.energy.gov/


Travel Web Sites

http://www.hotels.com/

http://www.orbitz.com/

http://www.hotwire.com/us/index.jsp

http://www.kayak.com/

Blackboard

ستقام اختبارات الميدتيرم يوم الثلاثاء 26-6-1440

حسب الجدول المعلن بلوحات الاعلان

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The registration for summer training will start from 5th week of second semester

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Class registration week 1

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