Dr. Ahmed G. Abo-Khalil

Electrical Engineering Department

Multi-chip module

A multi-chip module (MCM) is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other discrete components are packaged onto a unifying substrate, facilitating their use as a single component (as though a larger IC). The MCM itself will often be referred to as a "chip" in designs, thus illustrating its integrated nature.

Overview

Multi-Chip Modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a High Density Interconnection (HDI) substrate.

Multi-Chip Module packaging is an important facet of modern electronic miniaturization and micro-electronic systems. MCMs are classified according to the technology used to create the HDI (High Density Interconnection) substrate.

  • MCM-L - laminated MCM. The substrate is a multi-layer laminated PCB (Printed circuit board).
  • MCM-D - deposited MCM. The modules are deposited on the base substrate using thin film technology.
  • MCM-C - ceramic substrate MCMs, such as LTCC.

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